ASIC Design Methodology and related issues

ASICs (Application Specific Integrated Circuits) are increasingly being used on-board spacecraft, to reduce mass, size, power consumption and at the same time increase reliability. The drawback of using ASICs are the development cost, risk and schedule, and therefore particular attention is necessary when ASIC design is being performed.

ASIC Design and Manufacturing Requirements (Format: PostScript)

This document is used for ESA technology development contracts to minimise development risks and avoid that "unpleasant surprises" are found late in the development, from ensuring that the correct (i.e. fulfilling all requirements) specification is established to using a design methodology and IC technology suitable for high-reliability designs.
In many cases it is possible to reuse an ASIC for similar applications, if sufficient care has been taken during the development. While it may be technically more exciting to make a new design every time, the cost and risk conscious will try to maximise the usage of ASICs to be developed. An ASIC made available to several Users is called an ASSP (Application Specific Standard Product). Authors: Sandi Habinc and Peter Sinander. Also available in Adobe PDF format.

European ASIC Technologies commonly used for space applications

ASIC technologies commonly used for ESA developments include:

MITEL Semiconductor (S) 1.2 um and 2.0 um CMOS/SOS (Silicon on Sapphire). Contact person: Pascal Le Bohec (Pascal_LeBohec@mitel.com);

GPS (UK) 1.5 um CMOS/SOS (Silicon on Sapphire). Contact person: Trefor Davies (daviesht@LINCOLNDOD-PO.lincoln.gpsemi.com;

TEMIC/MHS 0.8 um and 0.6 um CMOS. Contact person: Amar Guennoun (Amar.Guennoun@matramhs.fr);

TCS 1.0 um and 0.8 um CMOS SOI (Silicon on Insulator). Contact person: Daniel Vellou (Daniel.VELLOU@TCS.THOMSON.FR).

Detailed technical information, design tools, quality class, cost and schedule is best answered by the respective manufacturer through the contact person indicated above.
ESA information regarding process status, qualification etc. is available from the Components Section in the Quality Department. Contact person: Ralf de Marino (RDEMARIN@estec.esa.nl)

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Peter Sinander (psi@ws.estec.esa.nl)

Last edited 6 April 1998

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